They are constructed of 2 main components, and insulating housing and an electrically conducting contact. The liquid crystal polymer insulators are molded and the contacts are a bundled gold-plated molybdenum wire. Gold plated copper spacers are used for long Z-axis connectors.
CIN::APSE positioning is designed into the insulating housing. Insulation housing are molded for high volume and machined for prototypes.
CIN::APSE connectors are positioned and mounted between boards and components using generally available alignment and compression hardware. Hardware can be press fit into PBC or utilized with a bolster plate for maintaining even compression across a large socket. Designers recommend PCB layout for gold plated pads and alignment holes locations.
Cinch CIN::APSE stacking connectors are used for connecting PCB or flex PCB to PCB or component to PCB without the use of solder. The contacts are compact with a pitch of 0.025". Each pathway on the CIN::APSE connector relies on a spring-like contact that establishes a durable electrical connection using mechanical pressure...
Cinch CIN::APSE stacking connector hardware includes insulated plates and fasteners to secure the stackup of 2 PCBs and the connecting CIN::APSE Stacking Connector. The plates support the backside of each PCB to distrubte sufficient compression across all contacts to PCB pads. The fasteners fix the position of the...
CIN::APSE® stacking connector jumpers are short flex PCB assemblies that are used for coplanar and right angle board to board connections. The jumpers in combination with the CIN::APSE ® stacking connectors and hardware provide a full board to board connect system. ...
CIN::APSE have high density and is easily installed in two basic steps, without soldering. They are also highly customizable and very reliable. See detail features description below.
• Maximize SWaP (Size, Weight and Performance) for space and weight constrained designs
• Pitch grid of 2.00 mm, 1.00 mm and 0.80 mm achievable
• Thin profiles from 0.020” and greater
• 2-piece design reduces additional space and weight
• Compression sufficient for establishes multiple points of contact, RoHS compatible
• No thermal processing or X-ray inspection required
• Reversible mating process for multiple cycles
• Design team available for mechanical drawings and product sketches
• Prototypes available for low quantities
• Profile thicknesses from 0.020” to 1.0”
• 2 to 7,356 contacts have been used per connector, but no limit exists
• IC-to-PCB, PCB-to-PCB, Flex-to-PCB, Component-to-PCB
• Excellent shock and vibration stability, 100 Gs shock, 20 Gs vibration
o Customer specific application passed @ 22,000 Gs
• Thermally stable, life and cycle testing, 5,000 hrs @ 170°C
o Customer specific application passed @ -200°C
• Electrically stable, > 1,000 MΩ @ 500 VDC
CIN::APSE is used in various applications such as Aerospace, Datacenters or Test Equipment. Below you can find some successful projects in which CIN::APSE products were used.
ASIC LGA Socket in P&W Engine FADEC Engine Controller
100GHz Oscilloscope
Board Interposer in AESA Radar RF Module
Flex to PBC Connector for Radarsat Constellation RF Module
LGA Sockets for Datacom Servers
LGA Sockets for Optical Network Switches
Harsh Environment Connectors for Military UVs Brochure
